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Home > Server Radiator > Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
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Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink
Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

Processor Heat Dissipation LGA2011 Rectangular Server Heat Sink Air-cooled Heat Sink

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Product Description

Product Description
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Specification
type CPU radiator
texture of material Copper base+copper fins
Heat dissipation method Air cooling
power waste 95W
Packing & Delivery
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General Profile
Established in 2006, focusing on electronic consumer/electronic component channels, and specializing in various IC, IT, and electronic accessories. Good, stable, and long-term relationships have been established with world-renowned integrated circuit manufacturers and direct customers of integrated circuits. This enables the integration of advanced technology that surpasses inventory control. All DRAM module products play an important role in the OEM market.
Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine
PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
FAQ
Q What are the main materials of this CPU radiator?
The radiator is constructed with a high-performance copper base and copper fins, which offer superior thermal conductivity for efficient heat dissipation.
Q What type of cooling method does this product utilize?
This radiator utilizes an active air cooling method to effectively lower the operating temperature of your CPU.
Q What is the maximum power waste (TDP) supported?
This CPU radiator is designed to handle a power waste (thermal design power) of up to 95W.
Q What is the primary application for this radiator?
It is designed as a CPU radiator to cool processors within desktop computer setups while maintaining compatibility with standard system builds.
Q Is the packaging secure for long-distance transport?
Yes, all products are packed under professional standards to prevent structural or cosmetic damage during transit and delivery.

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